Westbond Bonders
Manufacturer: Westbond
The Model 7372E is a convertible epoxy and eutectic die bonder that includes interchangeable tool head assemblies for bonding by either epoxy or eutectic methods. Pick-up tool rotation and radiant heat is standard on this model, but the NDNF also has additional heating resources available in the K1200D temperature controller. All programmed bond variables for each tool head assembly are retained in memory, and are retrieved upon conversion between modes. Mechanical scrub motion for the bond head, driven by the transfer motor, is programmable in both amplitude and number of repetitions: Bonding force is adjustable by a low rate coil spring. The work platform accommodates a variety of work pieces or different work holders. The platform surface is adjustable vertically through a range of 0.625 in, 0.094 above and 0.531 below nominal work elevation, by a single thumbscrew and with Planarity Control, allows for approximately 2 degree variation in any direction by 3 point adjustment.
The base model of this series is Model 7400E, an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is guided manually by the operator using hand/eye reference to bond targets and elevations. The 7476E now has a new and unique WEST-BOND three-axis micromanipulator in which the entire mechanism is arrayed above the work plane, so that there is now no limit to the size of a workpiece
The Model 7400A is an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semiconductor, hybrid, or microwave devices. The machine bonds aluminum or gold wires ranging from 0.0007 in. to 0.002 in. Bonds are made by the wedge-wedge technique using ultrasonic energy to attach aluminum wire at room temperature and adding work piece heat for gold wire. Wire is clamped and threaded diagonally under the bonding wedge, allowing independent feeding action but requiring front-to-back bonding direction. The bonding tool is lifted and lowered manually by the operator using hand/eye reference to the work elevations and to loop height.