Veeco Evaporator
Manufacturer: Veeco
The unit is used for thermal vacuum deposition of Al or Cr to the substrates situated some 30 cm above the evaporating metals and provides means for multiple-angle evaporation, controlled oxidation (including plasma oxidation), and in situ electrical characterization. It features:
- The rotation mechanism to deposit metals at angles within the range of ±10 degrees with respect to the normal to the plane of the wafer. The rotation is implemented through mechanical gear mechanism and the rotation angle is measured using a special angle monitor with resolution of 0.1 °C.
- The combination of a leak valve and a needle valve to provide a precise amount of oxygen into the chamber. Two regimes of oxidation are possible: controlled flow of O2 for the oxidation during the deposition and constant pressure oxidation of already deposited materials
- Special test fixture to perform in situ electrical measurements during the deposition of metals
- Mechanically controlled shutter and crystal thickness monitor, vacuum control system, mechanical and diffusion pumps
- Base pressure (with N2 cooled trap) is below 5 x 10-7 torr.