Plasma-Therm RIE
Manufacturer: Plasma-Therm
Plasma-Therm's 790 Series was designed to provide plasma scientists with a flexible and cost effective platform for parallel plate (capacitively coupled) reactive ion etch (RIE) processes. This 790 RIE system has been enhanced to include a vacuum load-lock, which allows the chamber to remain under vacuum at all times. The RIE is capable of processing two 4-inch wafers at a time, as well as small samples. The Cortex system software was upgraded in 2023.
Gas configuration: CHF3, CF4, SF6, O2, CH4, BCL3, Cl2 and Ar. Hydrogen (H2) is available if staff is contacted in advance.
Operating Instructions
Allowed Materials
Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO2 (glass), and cleaned Al2O3 (sapphire)
Prohibited Materials
High vapor pressure metals including: indium, lead, tin, and zinc
Magnetic materials including: iron, nickel, and cobalt