Oxford ALD
Manufacturer: Oxford
The Oxford Instruments FlexAL atomic layer deposition system is a plasma-enhanced ALD system for the monolayer growth of thin films. Self-limiting layer-by-layer growth ensures precise control, film conformity, and film repeatability. The system is currently installed with heated precursors for the deposition of Titanium, Silicon, Indium, Hafnium and Zirconium Oxide Films (Platinum metal possible). Hydrogen (H2), Ammonia (NH3), Oxygen (O2) and Nitrogen (N2) are available for plasma-assisted oxides and nitrides. Remote ICP plasma powers up to 400 W are possible. The system is load-locked and can accommodate sample temperatures up to 300 °C.
Precursors Installed: PDMAT, TMIn, TDMAH, Germanium, BDEAS, TDMAZ
Film types available: Ta2O5, In2O3, HfO2, Ge, SiO2, Si3N4, ZrO2
Process Gases: H2, NH3, O2, Ar, N2 and SF6