MemsStar XeF2 Etcher
Manufacturer: MemsStar
The MemsStar is a vapor-phase silicon etch system using xenon difluoride (XeF2) and a novel vapor delivery system. XeF2 etching is a chemical etch with no plasma, so there is no external energy source required and no damaging ion bombardment. The vapor delivery system enables the process to be performed in a continuous or pulsed flow.
XeF2 etching is highly isotropic and ideal for release etch processing when manufacturing membranes, micro-bridges, cantilevers, micro-mirrors and cavities. XeF2 is extremely selective to other materials used in the manufacture of various structures and in the integration with CMOS based processing. The system is also equipped with a downstream plasma generator, which can be used for O2 or N2 plasmas.
Operating Instructions
Allowed Materials
Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO2 (glass), and cleaned Al2O3 (sapphire)
Prohibited Materials
High vapor pressure metals including: indium, lead, tin, and zinc
Magnetic materials including: iron, nickel, and cobalt