Logitech CMP Sytem

Manufacturer: Logitech

The Logitech Orbis Chemical Mechanical Planarization (CMP) system is used for fine-scale polishing and planarization of a variety of metals in the damascene process as well as dielectrics. Small samples and full wafers up to 6" diameter can be polished on the system. Several slurries and pads are available to provide a range of polishing options depending on the material being processed. CMP applications often require customized process parameters (spin speed, force, and slurry) to achieve the desired result in most applications.
Users should expect to purchase their own polishing pads and wafer guides in order to use the system.

Cleaning procedure: Samples generally do not require special cleaning, unless needed to remove prohibited materials before processing. All materials to enter the equipment will be handled with wafer tongs by an operator wearing latex, poly, or nitrile clean gloves.

Allowed Materials

Semiconductor based materials, dielectrics, and metal films.

Prohibited Materials

Magnetic materials, organics, resists, tapes, epoxy, rubbers and plastics; organic materials; liquids of any kind.