Angstrom Sputter System

The Angstrom Engineering Sputter system is equipped with 4 DC and 2 RF sputtering magnetrons. It has a heated (500 Celcius) substrate holder that can rotate at up to 30 RPM for excellent uniformity. It contains an in-situ film thickness monitor that can determine deposition rate prior to film deposition to achieve highly accurate film thicknesses. It also has an in situ ellipsometer than can be used for monitoring film properties of dielectric films. The systems integrated loadlock allows for quick loading and unloading of substrates in minutes. Fully automated deposition recipes simplify the deposition process. Enhanced films can be obtained with reactive sputtering of Nitrogen or Oxygen using the poisoning tree software for optimized film properties. RF biasing is also achieved for pretreatment and cleaning prior to film deposition