Alcatel DRIE System
Manufacturer: Alcatel
The Alcatel 601 E is an automatic etching machine used exclusively for the plasma etching of silicon and related materials utilizing the Bosch Process. Through alternating SF6 etch followed by C4F8 passivation, large aspect ratios and high anisotropy can be achieved. It can work with 100 mm wafers at typical temperature of 20 °C and utilizes back side helium for thermal management using LN2 and electric heaters.
The system is currently equipped with SF6, C4F8, O2, and CF4 process gases.
Operating Instructions
Allowed Materials
Si, Ge, C, GaAs and its compounds, InP and its compounds, cleaned SiO2 (glass), and cleaned Al2O3 (sapphire)
Prohibited Materials
High vapor pressure metals including: Indium, lead, tin, and zinc
Magnetic materials including: iron, nickel, and cobalt